Communication Equipment
5G Base Station RF Module Project
Leading manufacturer of communication equipment
Project Background
A leading domestic telecom equipment manufacturer requires high-performance, high-frequency PCBs for its 5G base station RF modules to support 5G high-frequency signal transmission.
Customer Needs and Challenges
5G high-frequency signal transmission imposes stringent requirements on PCB loss factor (Df), dielectric constant (Dk), and dimensional stability, while also necessitating scalability for mass production.
Solutions
Utilizes Rogers RO4000 series high-frequency laminates with strict control of layer misalignment and warpage. Vacuum lamination minimizes voids to ensure signal integrity and consistency.
Implementation Results and Outcomes
- Industry-leading product performance
- Deployed across multiple 5G base station projects
- Monthly production capacity of tens of thousands of units
- Highly recognized by the customer's technical team
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