PCB Project for a Leading Smartphone Manufacturer
Leading domestic smartphone brand
Project Background
The client is a leading domestic smartphone brand with annual shipments in the tens of millions. Its flagship models require high-density interconnect (HDI) boards with stringent specifications for trace width/spacing, via diameter, and layer-to-layer alignment.
Customer Needs and Challenges
The product features an Any-layer HDI design with line width/space as narrow as 40μm/40μm and via hole diameter of 0.075mm. It must support high-volume, rapid delivery with monthly demand reaching tens of thousands of units.
Solutions
Laser drilling and electroplating are used for via filling, with AOI automated optical inspection ensuring circuit precision. Combined with an automated production line and strict process control, this guarantees both capacity and quality.
Implementation Results and Outcomes
- Yield consistently stays above 99.5%
- Monthly delivery capacity of tens of thousands of units
- A core supplier to our customers, with zero major quality incidents since the start of our partnership.
- Get your product to market 2 weeks early
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